3D High-speed Solder Paste Inspection Machine YSi-SP Specifications, External dimension
Eagerly awaited SPI from Yamaha Gives your one stop solution from printing machine to AOI
Specifications
| YSi-SP | ||
|---|---|---|
| Applicable PCB | L510×W460mm～L50×W50mm (single lane spec) *No dual lane specification available. |
|
| Horizontal resolution (FOV size) | 1）25µm / 12.5µm (approx. 50×50mm) 2）20µm / 10µm (approx. 40×40mm) 3）15µm / 7.5µm (approx. 30×30mm) *All are standard selection type. |
|
| Height resolution | 1µm | |
| Inspection items | Solder paste printing quality (volume, height, area and misalignment) | |
| Power supply | Single-phase AC 200V–230V ±10% | |
| Air supply source | Airless specification | |
| External dimension | L904×W1,080×H1,478 mm | |
| Weight | Approx. 550 kg | |
- Specifications and appearance are subject to change without prior notice.
External dimension
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- IoT/M2M Integration system - System allows linking our SMT machines to equipment made by other companies and give all-around high productivity in the mounting process.
